1) The machine adopts imported strong and durable ROCHLING double-layer plate which can be used in acid corrosion environment for a long time and prevent leakage.

2) 4", 5" and 6" silicon wafers can be cleaned by adopting the processes and equipments that can effectively treat organic and inorganic matters on the wafer surface by using SC1 and SC2.

3) Both manual and automatic operation design can be available. The automatic operation mode adopts two mechanical arms to operate, which can improve efficiency and reduce costs more effectively.

4) Cleaning Ability: 4 to 6 inch wafers, 25 pcs/2 baskets/batch

5) Comprehensive alarm function and fool-proofing design.

6) Modular design of tanks in each process, with the corrosion tank and pure water flushing tank placed in a uniform leak-bearing chassis. The corrosion tank is designed to exhaust air through the bottom and reduces the amount of exhaust air.

7) The process tank is designed to be lifted and lowered, making cleaning faster and more thorough.

8) The control part adopts imported brands PLC and HMI.

9) A PTFE pure water gun and a PTFE nitrogen gun are set on the right front side of the machine.

10) Equipment design standards are implemented according to semiconductor industry standards (SEMI-S2-93) and standardized and guaranteed according to ISO9001 quality management system.