1) The machine adopts imported strong and durable ROCHLING double-layer plate which can be used in acid corrosion environment for a long time and prevent leakage.

2) Automatic chemical nickel-plated and gold-plated silicon wafer cleaning equipment, and nickel-plated silicon wafers can be lifted and lowered in the process of cleaning.

3) Nickel water tank adopts five-sided quartz heating cylinder, which can drain water through the bottom, with temperature control accuracy ±1°C.

4) The control part adopts imported brands PLC and HMI, and all electrical parts and circuits that may contact with acid fog are treated by PFA anti-corrosion isolation;

5) A PTFE pure water gun and a PTFE nitrogen gun are set on the right front side of the machine.

6) Equipment design standards are implemented according to semiconductor industry standards (SEMI-S2-93 and standardized and guaranteed according to ISO9001quality management system.