Automatic Groove Etching Machine
1) The machine adopts imported strong and durable ROCHLING double-layer plate which can be used in acid corrosion environment for a long time and prevent leakage.
2) Adopting the external refrigeration cycle structures from large acid trough to small acid trough, it can corrode 4", 5" and 6" silicon wafers with grooves.
3) Automatic operation design, and easy and safe operation.
4) Temperature control ability RT~-20°C, and temperature control accuracy ±1°C.
5) Patented designed refrigeration coil, long time use without corrosion, and best direct refrigeration effect.
6) The evenness of groove etching is the best in China (up to 130μm ±3μm).
7) The control part adopts imported brands PLC and HMI;
8) A PTFE pure water gun and a PTFE nitrogen gun are set on the right front side of the machine.
9) Equipment design standards are implemented according to semiconductor industry standards (SEMI-S2-93) and standardized and guaranteed according to ISO9001 quality management system.
10) Invention patent number in China: ZL20140082522.0