Automatic Deep Etching Machine
1) The machine adopts imported strong and durable ROCHLING double-layer plate which can be used in acid corrosion environment for a long time and prevent leakage.
2) By adopting automatic design, it can completely corrode the silicon wafers, and replace the scribing machine which will cause edge burr and damage of the wafer.
3) Acid fluid cools the cycle, and material rotates and swings in the process tank so as to obtain uniform corrosion.
4) Automatic mechanical arm operates acid tank, water tank and discharge.
5) The control part adopts imported brands PLC and HMI, and all electrical parts and circuits that may contact with acid fog are treated by PFA anti-corrosion isolation. Electrical control elements are fully protected by the electrical cabinet CDA/N2;
6) A PTFE pure water gun and a PTFE nitrogen gun are set on the right front side of the machine.
7) Equipment design standards are implemented according to semiconductor industry standards (SEMI-S2-93 and standardized and guaranteed according to ISO9001quality management system.